Last Updated： Aggregation Period:Jan 21, 2026～Feb 17, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jan 21, 2026～Feb 17, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jan 21, 2026～Feb 17, 2026
This ranking is based on the number of page views on our site.
1～30 item / All 52 items
Slab-type solid-state laser fine processing equipment IS / BX / HD series
Edgewave Inc. 【Features】 ○ Output: IR 100W, Green 40W ○ Short pulse: 5–10ns ○ Beam shape: Gaussian, square, line ○ Glass substrate straight hole processing ● For more details, please contact us or download the catalog.
Precision processing solutions that achieve high accuracy, non-contact, and low damage for fine processing of high-hardness materials and semiconductor materials.
The combination of water jet and laser processing technology enables clean drilling, cutting, grooving, and surface processing with extremely minimal thermal impact. This device is an ultra-fine processing machine that achieves "high precision," "non-contact," and "low damage" processing required in the fields of semiconductors, electronic components, and precision instruments.
This is an introduction to examples of processing techniques for ultra-fine metal pipes, including one-sided through-hole machining, porous machining, slitting, groove machining, spiral groove machining, and notch machining.
It has become possible to perform various fine processing on thin, ultra-fine metal pipes that were previously unable to be processed due to deformation from external forces with contact tools and thermal effects with conventional thermal processing lasers. By using a rotating mechanism, it is possible to carry out processing in all rotational directions.
Processing is possible with a lightweight, high-precision machine! A compact-sized ultrasonic micro-machining device.
The "US-DT-30N" is a compact ultrasonic fine processing machine. It is capable of processing with a repeatability of ±0.005mm and positioning accuracy of 0.03mm, making it a lightweight, high-precision machine. Ultrasonic fine processing is suitable for machining hard and brittle materials as well as difficult-to-machine materials. Our ultrasonic technology will solve your problems. 【Features of Ultrasonic Processing】 ■ Quality Improvement By finely breaking brittle materials during processing, it minimizes damage to the workpiece, enabling high-quality machining. ■ Cost Reduction By shortening processing time and reducing machining resistance, the tool life is extended, leading to cost savings. ■ Deep Hole Machining By using an ultrasonic processing machine, deep hole machining of hard and brittle materials or difficult-to-machine materials is achieved, which is not possible with other methods. *If you have any requests, we can accommodate even a production quantity of one per year. *For more details, please refer to the PDF document or feel free to contact us.
鉄鋳物筐体で安心の高剛性。精度本位の微細加工に最適な小型微細加工機です。
◆精度を求めるならこの1台 剛性の高い鉄鋳物を筐体に採用。小径穴や細溝などの微細加工をより高速に、より精度よく行うことができます。 高品位な精度が求められる加工に最適な1台です。 【事例】 ■アルミナセラミック形状加工 ■ジルコニアセラミック穴あけ（φ90μm穴） ■アルミ球面加工 ■アクリル形状加工及び微細穴加工（φ100μm） ■パイレックスガラス溝幅100μm ◆加工内製化 ◆引張試験片加工機用にも
From research and development to mass production! This compact NC machining machine can perform genuine machining, such as spherical processing, micro-hole processing, and fine groove processing, even in limited spaces!
◆Wide Range of Processing Applications Compatible with a wide variety of materials, from resins and metals to brittle materials like glass and silicon, as well as ceramics! Suitable for research and development purposes, and can also be used as a mass production machine. The effective stroke is a reassuring 240×250×100mm. With a full cover design, wet processing is possible on a tabletop. ◇AC100V Power Supply That Can Be Used Anywhere The biggest feature of the Micro MC series is its convenience. It is compact and powered by AC100V, making it easy to install anywhere, ideal for low-cost equipment investment. 【Examples】 ■ Microreactor channel groove processing ■ Acrylic shape processing, fine hole processing ■ Aluminum spherical surface processing ■ Alumina ceramic shape processing ■ In-house processing ■ Tensile test specimens
Micro-machining of brittle materials is also possible! A micro-machining machine that balances a compact design with high performance!
The "Micro MC Series" is a compact microprocessing machine primarily designed for R&D applications. It operates on AC100V power supply (domestic), allowing it to be installed in limited spaces, and, unlike typical small processing machines, it supports both dry and wet processing as standard. It is ideal for low-cost equipment investment for a wide range of processing needs. Custom-made devices can also be proposed according to your requirements and budget. 【Features】 ■ Compact design of the housing ■ High performance ■ Supports both dry and wet processing ■ Ideal for low-cost equipment investment ■ Compatible with various materials, including ceramics and metals ◆ Examples For in-house processing and tensile test specimen processing machines Feel free to contact us!
Achieving long-term high precision maintenance! A high-speed micro-machining machine that has further evolved with various improvements.
"Android II" is an ultra-high-precision high-speed machining machine that pursues a processing accuracy of ±1μm or less. Improvements have been made to minimize displacement to the extreme even under high-speed machining conditions, achieving even higher precision processing. Additionally, it has been refined in response to further requests from customers. [Features] ■ Enhanced thermal deformation countermeasures (Active H.I.S) ■ Cooling of the guide carriage ■ Automatic detection of spindle saturation ■ Reduced warm-up time, shortening non-processing time ■ User-friendly cutting fluid nozzle with adjustable direction *For more details, please refer to the PDF document or feel free to contact us.
Reduction of spindle runout with a dedicated spindle! A high-precision high-speed micro-machining machine that pursues cutting beauty.
The "CEGA-SS 300" is a high-precision, high-speed micro-machining machine equipped with an advanced thermal separation system, Advanced H·I·S control. It features a 5-axis configuration that achieves an extreme fusion of XYZ high-precision 3-axis positioning capability and additional 2-axis indexing accuracy. The synergistic effect of a stable feed mechanism and a frame structure designed for high-precision long-term maintenance promises a higher level of machining surface quality. 【Features】 ■ Reduction of spindle runout with a newly developed dedicated spindle ■ Adoption of an evolved thermal separation system ■ Significant suppression of thermal displacement of the machine body ■ Stable feed mechanism ■ Frame structure for high-precision long-term maintenance *For more details, please refer to the PDF document or feel free to contact us.
We accept orders for micro holes and micro cutting processing, from prototype production to mass production.
Material: Glass with ITO film Film thickness: 90nm / Removal width: approximately 20μm / Pattern size: approximately 5mm x 5mm At Higashi-Nari Electro Beam Co., Ltd., we utilize precision laser processing for fine drilling, cutting, groove processing, and more. Selection of laser wavelengths (IR, SHG, THG) is available. We can accommodate various materials including various types of stainless steel, titanium, molybdenum, tantalum, niobium, aluminum, copper, iron, ceramics, glass, and resin materials. Please feel free to consult with us. [Features] ○ Suppression of metal burr generation ○ Suppression of thermal sagging in resin materials ○ Drilling of holes less than 100μ For more details, please contact us or download the catalog.
We accept orders for micro holes and micro cutting processing, from prototype production to mass production.
Material: Cobalt alloy Pipe diameter: φ (phi) 1.55mm / Wall thickness: 100μm / Cutting width: approximately 40μm / Remaining width: approximately 50μm At Higashi-Nari Electro Beam Co., Ltd., we utilize laser technology for precision processing, offering services such as fine hole drilling, cutting, and groove processing. Selection of laser wavelengths (IR, SHG, THG) is available. We can work with a variety of materials including various types of stainless steel, titanium, molybdenum, tantalum, niobium, aluminum, copper, iron, ceramics, glass, and resins. Please feel free to consult with us. [Features] ○ Suppression of metal burr generation ○ Suppression of thermal sagging in resin materials ○ Hole drilling below 100μm For more details, please contact us or download the catalog.
We accept orders for micro holes and micro cutting processing, from prototype production of one piece to mass production.
Material: Cobalt alloy Pipe diameter: φ (phi) 1.55mm / Wall thickness: 100μm / Cutting width: approximately 40μm / Remaining width: approximately 20μm At Higashi-Nari Electro Beam Co., Ltd., we utilize laser technology for microfabrication, offering services such as fine hole drilling, cutting, and groove processing. Selection of laser wavelengths (IR, SHG, THG) is available. The materials we can work with include various types of stainless steel, titanium, molybdenum, tantalum, niobium, aluminum, copper, iron, ceramics, glass, and resins, among others. Please feel free to consult with us. 【Features】 ○ Suppression of metal burr generation ○ Suppression of thermal sagging in resin materials ○ Hole drilling below 100μm For more details, please contact us or download the catalog.
We accept orders for precision hole drilling and micro cutting processing, from prototype production to mass production.
Material: Tungsten Plate thickness: 50μm / Hole diameter: φ (phi) 300μm At Higashi-Nari Electro Beam Co., Ltd., we utilize laser technology for precision processing, offering services such as fine hole drilling, cutting, and groove processing. You can choose from various laser wavelengths (IR, SHG, THG). We can work with a wide range of materials including various types of stainless steel, titanium, molybdenum, tantalum, niobium, aluminum, copper, iron, ceramics, glass, and resins. Please feel free to consult with us. 【Features】 ○ Suppression of metal burr generation ○ Suppression of thermal sagging in resin materials ○ Hole drilling below 100μm For more details, please contact us or download the catalog.
We accept orders for micro holes and micro cutting processing, from prototype production to mass production.
Material: SKD11 Processing diameter: φ (phi) 30μm / Processing depth: 15μm / Processing pitch: 50μm / Number of processes: Approximately 360,000 locations At Higashi-Nari Electro Beam Co., Ltd., we utilize laser technology for micro-machining, offering services such as fine hole drilling, cutting, and groove processing. Selection of laser wavelengths (IR, SHG, THG) is available. We can accommodate various materials including various types of stainless steel, titanium, molybdenum, tantalum, niobium, aluminum, copper, iron, ceramics, glass, and resins. Please feel free to consult with us. 【Features】 ○ Suppression of burr generation in metals ○ Suppression of thermal sagging in resin materials ○ Hole drilling below 100μ For more details, please contact us or download the catalog.
A space-saving tabletop ultrasonic fine processing machine equipped with a high-speed, high-precision spindle.
It operates on an all AC 100V power supply, so it can be installed in laboratories, experimental rooms, offices, and more.
![[Prototype Acceptance in Progress] Examples of Laser Microfabrication Applications](https://image.mono.ipros.com/public/product/image/e60/2000156206/IPROS6108904142426905709.jpg?w=280&h=280)
We will respond to your prototype requests with cutting-edge laser microfabrication technology, providing high-quality processing that includes three-dimensional shapes.
Hikari Corporation is a joint venture with Germany's 3D-Micromac, a world-class manufacturer of laser microprocessing equipment, and acts as the general agent in Japan. We have introduced 3D-Micromac's picosecond laser microprocessing equipment within Hikari Corporation. With this cutting-edge laser microprocessing equipment, we will respond to your prototype requests. We achieve high-quality processing for hole drilling, cutting, and marking, regardless of the material being processed. 【Application Examples】 ■ Metals: Micro hole processing, fine groove processing, thin film removal, marking, fine engraving, fine cutting ■ Ceramics, Glass, etc.: Fine engraving, fine cutting, marking, micro hole processing, laser lift-off ■ Resins: Micro hole processing, fine cutting, fine groove processing, coating removal For more details, please contact us or refer to our catalog.
[Laser Micromachining Examples] Hole Processing Examples for Ceramic, Stainless Steel Plates, and Polyimide
Introducing three examples of micro-hole processing! You can also view processing photos from the left. ■ Hole processing of Φ1 mm in ceramic It can be seen that a vertical hole without taper has been made in a 1 mm thick ceramic (AlN). Additionally, there is no thermal impact, resulting in very clean edges. ■ Inverted taper hole processing This is a cross-section view of the hole processing results. Holes were processed in a 1 mm thick stainless steel plate. The photo shows the results of laser processing from left to right. The taper is controlled, resulting in an inverted taper on the laser emission side of the hole. ■ Hole processing of polyimide This is the laser entry side. Holes with a diameter of 25 µm have been processed. The edges are very clean, and there is almost no thermal impact. The material is 25 µm thick polyimide. This is applied to inkjet nozzles, processing over 1,000 holes per head. For more details on various examples of laser processing, please download and view "Case Studies on the Introduction and Problem Solving of Laser Microprocessing Machines Vol. 1" from the link below.
[Laser Micromachining Examples] Polyimide, Ultra-Fine Hole Machining, and Hole Machining Examples on Stainless Steel
Here are three examples of micro hole processing! You can also view processing photos from the left. ■ Hole processing of polyimide This is the laser emission side in the left photo. The reverse taper (the hole diameter on the emission side is larger than that on the incident side) is controlled at 13°. Positioning accuracy of ±250 nm and repeatability of ±250 nm have been achieved. ■ Ultra-fine hole processing A hole of approximately Φ10 µm was processed using a laser on a metal plate with a thickness of 100 µm. There is no thermal impact, resulting in a very clean round hole. Such high aspect ratio laser microprocessing is also possible. ■ Hole processing on stainless steel This is hole processing on 100 µm thick stainless steel SUS430. A fine hole with a diameter of Φ35 µm can be processed using a laser. It is also possible to create a mesh structure with multi-hole processing without distortion due to heat. For more details on various examples of laser processing, please download and view "Laser Microprocessing Machine Introduction & Problem Solving Case Collection Vol. 1" from the link below.
[Laser Micromachining Examples] Mesh processing of stainless steel, dimple processing on brass.
Introducing two machining examples related to high-speed fine multi-hole processing! You can also view processing photos from the left. ■ Mesh Processing of Stainless Steel We created a mesh structure by machining through holes with a diameter of Φ30µm at a pitch of 50µm in stainless steel SUS430 with a thickness of 100 µm. The number of holes exceeds 80,000. The processing speed is 0.25 seconds per hole. It is possible to arrange the holes in a staggered pattern, as well as in a grid layout as shown in the photo. Additionally, larger area mesh processing is also possible. Since we are scanning the laser spot to create holes, we can achieve various shapes of holes, including round, elongated, square, and triangular holes. ■ Dimple Processing on Brass This processing involves arranging stop holes with a diameter of Φ30µm and a depth of 15µm at a pitch of 40µm. The laser can process not only through holes but also stop holes. We can produce more than 30 dimples per second. The pitch and depth can be freely set. While some lasers cannot process brass, 3D-Micromac has the know-how to process it based on years of experience. *For more details on various other examples, please download and view "Laser Fine Processing Machine Introduction & Problem-Solving Case Study Collection Vol. 1" from the link below.
[Laser Microprocessing Examples] Examples of Y-shaped and C-shaped hole processing, and grooved round hole processing.
Introducing four machining examples related to precision shape cutting! You can also view processing photos from the left. ■ Y-shaped hole machining Holes can be drilled into stainless steel plates thicker than 500 µm while controlling the taper. This is from the laser entry side. The processing time was 100 seconds. 3D-Micromac excels at machining irregular holes while controlling the taper. ■ C-shaped hole machining The hole shape is completely customizable. This shows the laser exit side. We respond to strict dimensional tolerance requirements with precise laser processing. It is gaining attention as an alternative to wire electrical discharge machining (EDM). ■ Y-shaped hole machining Y-shaped holes are being machined into a 500 µm thick stainless steel plate. This is a SEM photo from the laser entry side. The groove width is 50 µm. The edges are sharp. ■ Grooved round hole machining We are machining round holes with grooves. It is possible to cut out freely shaped designs like this. It has received high praise as a highly productive device. For more details on various other examples, please download and view "Laser Microprocessing Machine Introduction & Problem-Solving Case Collection Vol. 1" from the link below.
We have a variety of laser processing machines available!
This catalog is a comprehensive catalog of Delphi Laser Japan Co., Ltd., which primarily engages in equipment sales, equipment development, laser processing, and maintenance in the Japanese market. It features various laser processing equipment, including "ultra-short pulse laser fine processing equipment" used for high-quality fine hole drilling, "ultraviolet laser fine processing equipment," and "ceramic substrate laser processing equipment." We offer a wide range of products that can be used for various applications. [Contents] ■ Ultra-short pulse laser ultra-fine processing equipment ■ Ultraviolet laser fine processing equipment-D ■ Ultraviolet laser fine processing equipment-S ■ Ceramic substrate laser processing equipment ■ Light guide plate dot equipment, etc. *For more details, please refer to the catalog or feel free to contact us.
This is a femtosecond laser micromachining system developed for laboratories. It transforms into a complete experimental lab on an optical table.
Manufacturer: Workshop Of Photonics (Lithuania) With a linear positioning stage boasting nano-order resolution and precision, high-performance galvanometer scanners, and the versatile control software "SCA," FemtoLAB transforms into a complete experimental lab on an optical table. 【Features】 Custom design Selectable laser High-efficiency beam transmission and power control Highest quality optical components High-precision positioning stage Additional features beyond standard options available upon consultation
It is an industrial turnkey femtosecond laser system.
Manufacturer: Workshop Of Photonics (Lithuania) The system configuration is meticulously tailored to specific microfabrication applications (such as laser cutting, scribing, drilling, milling, etc.). The device features a safe laser class I enclosure and is controlled by the software "SCA." 【Features】 Processing speed up to 300mm/s Submicron resolution Minimal thermal impact through femtosecond microfabrication Submicron precision positioning based on aerospace technology Precise spatial beam control with high-performance galvanoscanners Pulse count control from single shot to 1MHz Spatial and temporal synchronization with moving targets is possible Proprietary software capable of controlling all integrated devices
It is a system that enables fine processing such as cutting and drilling of sapphire.
Manufacturer: Workshop Of Photonics (Lithuania) This system is equipped with a linear positioning stage boasting nano-order resolution and precision, a high-performance galvanometer scanner, and the versatile control software "SCA." [Features] Custom design Selectable laser High-efficiency beam transmission and power control Highest quality optical components High-precision positioning stage Additional features beyond standard options can also be discussed.
For processing such as glass drilling, glass scribing, hard material groove processing, and Si scribing!
Our laser microprocessing machine, the 'LP Series', is a device capable of high-speed processing over a wide area, thanks to the combination of a galvanometer scanner and a high-precision XY stage. With the incorporation of a coaxial observation system, it allows for high-resolution processing observation. Additionally, it can accommodate various types of laser oscillators. 【Features】 ■ High precision, high-speed processing, and high value-added processing ■ Compatible with laser oscillators suitable for processing purposes ■ XY stage processing, galvanometer scanning processing, and combined XY stage/galvanometer processing ■ Customization options tailored to processing applications ■ Suitable for both experimental processing applications and production equipment *For more details, please download the PDF or feel free to contact us.
Multifunction Pico-Second and Femto-Second Laser Micromachining Machine
We can propose precision processing equipment tailored to your needs, such as coaxial observation, ultra-precision stages, and dedicated optical systems for drilling, on a multifunctional platform.
Over 1,000 units introduced. Achieving high-precision cutting, shape cutting, slicing, and marking. Sample processing consultations are currently being accepted.
The "DCS Series" is a laser fine processing machine equipped with wavelengths, pulse widths, and output energy that can precisely cut, shape, slice, and mark CVD diamonds. It is utilized in countries around the world, with over 1,000 units installed. It is used in processes such as tool edge processing and the precise polishing of semiconductor wafers. 【Examples of Applications】 ■ Tool edge processing ■ 4P diamond three-dimensional shape processing ■ Internal marking ■ Polishing of diamond wafers *For more details, please refer to the materials available for download in the catalog. We are also accepting inquiries for sample processing. Feel free to contact us.
It is a compact excimer laser micromachining device that can be installed on a tabletop.
By using an excimer laser, which operates at ultraviolet wavelengths, excellent processing quality can be achieved. It is effective for processing polymer resins, thin films, metal films, and glass materials.
Excimer laser fine processing equipment LB1000/1500
Compatible with small to large excimer lasers, fixed reduction projection magnification of 4 to 18 times, customizable devices with a variety of options. 【Features】 ○ Customization possible with a variety of optical system options ○ Easy installation and modification of options as needed ○ Reduction projection magnification can be set between 4 and 18 times ○ Observation system with real-time monitoring ○ User-friendly operation with multifunctional software ○ Dedicated options can be remotely controlled from a PC ○ Standard 200×200mm XY stage ○ Compatible regardless of the size or manufacturer of the excimer laser ○ Usable with excimer lasers already owned ● For more details, please contact us or download the catalog.
Ultrasonic fine processing machine that achieves high quality through the integration of ultrasonic vibration.
The ultrasonic machine is a processing device that combines a rotational motion of up to 8000 min⁻¹ with ultrasonic vibrations of 40,000 times per second, specifically designed for diamond tools. It has achieved precise and fine processing of high-hardness brittle materials such as ceramics, glass, and single crystal silicon, which were difficult to process conventionally. ● Compatible with high-hardness brittle materials Processing of high-hardness brittle materials and new materials such as glass, single crystals (silicon, sapphire, etc.), and cemented carbide is possible. ● Achieves high productivity It allows for extended tool life and significant reduction in processing time. ● Achieves high-quality processing With positioning accuracy of 0.004 mm and repeatability of ±0.001 mm, this high-precision machine integrates ultrasonic vibrations to ensure high quality. ● Quiet & Clean Processing at low rotational speeds generates no noise, and the processing coolant is used in low pressure and small amounts, preventing splatter and providing a comfortable working environment.
